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A method in which electronic components are mounted directly onto a printed circuit board.
Providing strong mechanical bonds for bulkier and heavier components.
A thin polymeric film which conforms to the contours of a printed circuit board to protect the board's components.
The process of encapsuling the PCB in a resin in order to protect against diverse conditions.
Assembly for sub-systems and modules as well as for full product integration into an outer case or metal or plastic case or enclosure.
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