Surface Mount Technology revolutionizes PCB assembly by placing components directly onto the surface of the PCB, as opposed to through-hole technology that inserts components into drilled holes. SMT enhances the manufacturing process by optimizing space, reducing weight, and facilitating automated assembly techniques.
The process generally starts with stencil preparation, which is a sheet of stainless steel that allows solder paste to be deposited in alignment with the component placement. Once the solder paste is in place and the stencil is removed the components are placed by our automated pick-and-place machine, this process is extremely efficient and saves on production time when compared to manual hand placement. Once the components are placed, the board is passed through a reflow soldering machine. This consists of a controlled heating environment within the machine which melts the solder paste causing it to solidify so that solder joints are formed. Our specially trained technicians monitor the temperature to ensure the board is not damaged or poorly soldered. The final step is the inspection stage, we use AOI technology to ensure the boards we produce are inspected to the highest standard.
Pulsar Manufacturing can place components from 01005 packaged components, right through to the larger SMT packages with absolute precision to IPC-A-610 standards. The combination of our Surface Mount Technology and Automated Optical Inspection ensures that a high level of placement accuracy, solder joint integrity and quality is consistently achieved every time. State-of-the-art machines and technology allow up to 57,000 placements per hour and Pulsar Manufacturing are fully equipped to undertake PCB batches from low to high quantities.
Still unsure if our SMT service is for you? Get in touch and one of our team will be glad to help.