Through-hole mounting technique refers to the mounting scheme used for electronic components that involve the use of leads on components that are inserted into holes drilled in Printed Circuit Boards (PCB) and soldered to pads on the opposite side by manual assembly (hand placement). Through-hole mounting provides strong mechanical bonds compared to SMT, but the additional drilling required makes the PCB's more expensive to produce as well as requiring manual assembly labour.
Through-hole mounting techniques are now usually reserved for bulkier or heavier components such as electrolytic capacitors or components in larger packages that require the additional mounting strength. With 25 years of industry experience, the team at Pulsar Manufacturing are highly skilled and knowledgeable, all workmanship is certified to IPC- 610 standards, and all Inspectors, Supervisors, Team Leaders, and Production Engineers are IPC-A-610 certificated specialists. Ensuring that your product is of the highest quality, each and every time.