PCB assembly has become smaller and smaller over the years and new designs are using significantly more ball grid array (BGA) and other types of devices with hidden solder connections, such as quad flat no-leads (QFN) and land grid arrays (LGAs). Such devices often have performance and cost advantages over larger packages with leads. X-ray provides the answer where you cannot optically see the solder connections.
X-ray can be used as part of the ‘first-off’ inspection process, helping to ensure enhanced quality for electronic assembly requirements
Another benefit of X-ray inspection is in resolving quality issues. X-ray allows inspection without resorting to potentially destructive re-work.
The experienced team of test and production engineers at Pulsar Manufacturing allows for high-quality products and quick turn around times. The X-Ray process allows our engineers to ensure that the flow solder is optimised for the leaded devices. Our main commitment at Pulsar Manufacturing is to help our customers with support and enhanced quality for electronic components and Printed Circuit Board requirements. Open communication channels with our clients help to establish requirements early on and create all-important transparency, giving customers even more control over their products.